As per information shared by WinFuture , the Snapdragon X2, identified by the model number SC8480XP, is anticipated to adopt a system in package SiP design, integrating both RAM and flash storage directly within the processor package. Leaked import export documents suggest configurations may include up to 48GB of SK hynix RAM and a 1TB SSD. This integration aims to enhance data transfer speeds and energy efficiency by reducing latency between components. The core architecture and clock speeds...
